Smartkem Collaborates with Manz Asia for Advanced Computer and AI Chip Packaging Solutions
Manz Asia will be demonstrating its advanced inkjet metallization using Smartkem’s advanced dielectric materials at SEMICON® SEA 2025 in Singapore, May 20-22, 2025.
Visit Manz Asia at Booth no. L1314.
MANCHESTER, England, May 19, 2025 /PRNewswire/ — Smartkem (Nasdaq: SMTK), which is seeking to change the world of electronics with a new class of transistor technology, today announced that it has entered into a collaboration with Manz Asia, a developer of production solutions for semiconductor advanced packaging manufacturing sectors. The collaboration includes the demonstration of inkjet printable dielectric layers for use in advanced computer and AI chip packaging solutions at this year’s SEMICON® SEA in Singapore, May 20-22, 2025.
Smartkem Chairman and CEO, Ian Jenks, commented:
We’re thrilled to be working with Manz Asia to address a fast-growing opportunity in the market for advanced computer and AI chip packaging.
“As the demand for AI leads to increasingly complex servers, our materials combined with Manz Asia’s printing technology have the potential to enable large area panel chip packaging beyond the existing constraints of today’s 300mm wafer packaging. Panel level packaging is a market expected to grow to approximately $600 million in 2030, a 27% compound annual growth rate from 2024. “[1]
Manz Asia General Manger, Robert Lin, commented:
Manz Asia is committed to advancing green manufacturing and smart production through the development of high-precision inkjet printing equipment.
“Our maskless inkjet technology enables accurate material deposition and supports a wide range of inks, making it suitable for various substrates—including PI, ABF, EMC, silicon, and glass—in both wafer and panel formats. The collaboration with Smartkem marks a significant step in demonstrating how our inkjet platform, combined with next-generation dielectric materials, can deliver scalable and sustainable solutions for semiconductor advanced packaging.”
Building on the UV curable dielectric layer chemistry developed at Smartkem’s R&D facility for thin film transistor fabrication, Smartkem has designed ink formulations suitable for use in advanced computer and AI chip packaging applications. These inks have been co-developed with Manz Asia to be compatible with its existing inkjet-based semiconductor production equipment.
Panel level packaging on rectangular wafers offers key advantages over traditional packaging on circular wafers, including:
- Higher throughput, as a larger print area means more chips can be packaged simultaneously;
- Lower cost per chip from economies of scale with use of printed circuit board like manufacturing equipment;
- Better material utilization from less edge loss compared to circular wafers; and
- Improved integration supported by complex fan-out wafer-level packaging at a larger scale.
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Smartkem Collaborates with Manz Asia for Advanced Computer and AI Chip Packaging Solutions, source
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