June 2025 is reaching its end and we have another mention on the Huawei Ascend 910D chip details. A tipster has once again shared some key insights about the next-gen Ascend AI processor, revealing the key changes over the previous version.
Going into the details, Huawei Ascend 910D is seemingly the next-gen AI chip. It is already in rumor to draw level with Nvidia’s tech-pack SoCs using advanced capabilities.
Now X tipster @Jukanlosreve talks about the company’s latest patent for a quad-chiplet design. The overall layout is somewhat identical to Nvidia’s quad-die Rubin Ultra. If true, Huawei’s new chip could be a major rival for the US chipmaker.
Chiplet is a modular integrated circuit where a monolithic chip is divided into smaller pieces. It is then placed into a single package. This separation method helps in developing a system by combining various smaller SoCs into one package.
In particular, the method is called System-In-Package (SiP). When this method takes a broader shape and integrates various types of chips in a single package, it is known as heterogeneous integration.
On the other hand, a die is a single, complete integrated circuit fabricated on a semiconductor wafer. If this die size increases, the number of chips made via a single wafer decreases, reducing profitability. Besides, defects also impact production.
The tipster adds that since Huawei lacks advanced EUV machines to build high-profile AI processors, it is focusing on enhancing the chiplet design.
It will work on hybrid bonding – a method that combines copper-to-copper bonding with dielectric bonding to create high-density, high-performance interconnects for advanced 3D device stacking. The technique will further deliver superior signal and power delivery compared to traditional methods.
Here, Huawei seems ahead of Samsung and Apple, as the foreign rivals are still considering adopting chiplets in their products by 2026-2027. But the Chinese firm has seemingly started integrating chiplets in its products.
Simply put, the leak suggests that Huawei has some major plans for its new-gen AI Ascend 910D chip design. Things will be clear when this SoC debuts officially in the market.
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More chip design details about Huawei Ascend 910D surfaced online – Huawei Central, source
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