Ceva Partners with Microchip Technology to Enable AI Acceleration Across Edge Devices and Data Center Infrastructure
ROCKVILLE, Md., Nov. 5, 2025 /PRNewswire/ — Ceva, Inc. (NASDAQ: CEVA), the leading licensor of silicon and software IP for the Smart Edge, today announced a long-term partnership with Microchip Technology Inc. (NASDAQ: MCHP), a broadline supplier of semiconductors committed to making innovative design easier through total system solutions. This collaboration will embed Ceva’s NeuPro™ family of Neural Processing Units (NPUs) in Microchip’s products, accelerating the deployment of scalable AI across its broad range of Compute, Communication and Security products.
Microchip’s selection of Ceva’s NeuPro family, spanning NPUs for the smallest embedded applications to those required for generative AI, reflects a strategic commitment to deliver AI as a native capability in billions of devices. This reinforces Microchip’s leadership across industrial, data center, aerospace, automotive, consumer and communications markets. By seamlessly incorporating Ceva’s NeuPro Studio – a unified AI Software Development Kit (SDK) for the NeuPro NPU family – into its own SDK, Microchip can deliver a comprehensive developer experience to its customers to train, import, optimize and deploy AI models.
Mark Reiten, Corporate Vice President, responsible for AI at Microchip, said:
Microchip is committed to making AI a differentiating capability across our product portfolio,
“Collaborating with Ceva enables us to bring the full power of AI to our products, enabling richer, faster, and more intelligent experiences for our customers.”
Amir Panush, CEO of Ceva, said:
AI is becoming foundational across devices, systems and infrastructure,
“Our partnership with Microchip reflects this industry-wide shift. By providing scalable NPU technology together with NeuPro Studio, we enable Microchip to extend its leadership and deliver AI-driven innovation directly to their customers.”
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Ceva Partners with Microchip Technology to Enable AI Acceleration Across Edge Devices and Data Center Infrastructure, source
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